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Challenges in 3D memory manufacturing and process integration

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1 Author(s)
Chandrasekaran, N. ; Micron Technol., Boise, ID, USA

Memory industry transition from planar to 3D scaling and the introduction of several new emerging memory devices into manufacturing over the next decade is going to drive several new and unique manufacturing and process integration challenges. The inflection point we are faced with is a new paradigm where advancements in materials science, non-litho equipment technology, testing and characterization methods, and control methodologies will lead the way for scaling cadence.

Published in:

Electron Devices Meeting (IEDM), 2013 IEEE International

Date of Conference:

9-11 Dec. 2013